Download ASM AMICRA NOVA plus Die Bonder for Wafer Level Packaging
ASM AMICRA NOVA plus Die Bonder for Wafer Level Packaging
ASM AMICRA NOVA plus Die Bonder for Wafer Level Packaging
ASM AMICRA's highly accurate die bonder / flip chip bonder system (+/-2,5 µm), with multi-chip capability, a modular machine concept and much more! See our website: /redirect?redir_token=E2ykEcl1ucOq...
ASM AMICRA's highly accurate die bonder / flip chip bonder system (+/-2,5 µm), with multi-chip capability, a modular machine concept and much more! See our website: /redirect?redir_token=E2ykEcl1ucOq-8OMCTYaX0_0Aj58MTU0MzU0NzI2N0AxNTQzNDYwODY3&v=Wwm9kMoULuk&q=http%3A%2F%2Famicra.com%2Fproducts%2Fdie-flip-chip-bonder%2Fnova-plus-die-bonder-and-flip-chip-bonder&event=video_description
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